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BSI BS 3934-5:1997

Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
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BSI BS 3934-5:1997

Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

PUBLISH DATE 1997
PAGES 38
BSI BS 3934-5:1997
AUTOMATED BONDING (TAB) OF INTEGRATED CIRCUITS
SDO BSI: British Standards Institution
Document Number BS 3934
Publication Date Sept. 15, 1997
Language en - English
Page Count 38
Revision Level
Supercedes
Committee
Publish Date Document Id Type View
Sept. 15, 1997 BS 3934-5:1997 Revision
Jan. 1, 1992 BS 3934-5:1992 Revision