1.1Â This practice covers procedures for determining operating regions that are safe from metallization burnout induced by current pulses of less than 1-s duration.
1.2Â This practice is based on the application of unipolar rectangular current test pulses. An extrapolation technique is specified for mapping safe operating regions in the pulse-amplitude versus pulse-duration plane. A procedure is provided in Appendix X2 to relate safe operating regions established from rectangular pulse data to safe operating regions for arbitrary pulse shapes.
4.1Â Solid-state electronic devices subjected to stresses from excessive current pulses sometimes fail because a portion of the metallization fuses or vaporizes (suffers burnout). Burnout susceptibility can vary significantly from component to component on a given wafer, regardless of design. This practice provides a procedure for establishing the limits of pulse current overstress within which the metallization of a given device should survive.
| SDO | ASTM: ASTM International |
| Document Number | F615 |
| Publication Date | May 1, 2013 |
| Language | en - English |
| Page Count | 5 |
| Revision Level | 95(2013) |
| Supercedes | |
| Committee | F01.11 |