1.1Â This test method covers a simple qualitative procedure for quickly screening whether an adhesive will, under recommended application conditions, bond to a given substrate without actually making bonded assemblies.
5.1Â This is a quick, simple, and inexpensive test method for qualitatively determining, without the need to prepare bonded test specimens, whether the adhesive under consideration will bond to a particular substrate. If the results are acceptable, then standard quantitative adhesive test procedures can be used to obtain quantitative measurements of the adhesive's performance.
5.2Â This test method can also be used to compare relative adhesion of several adhesives to given substrates.
5.3Â It can be used to determine whether an adhesive will continue to adhere to the substrate under specified environmental conditions.
| SDO | ASTM: ASTM International |
| Document Number | D3808 |
| Publication Date | July 1, 2013 |
| Language | en - English |
| Page Count | 2 |
| Revision Level | 01(2013) |
| Supercedes | |
| Committee | D14.40 |